This article presents a novel 3D-printed carbon-based conformal electromagnetic interference (EMI) shielding module for integrated electronics. The module is fabricated using functional inks containing graphene and carbon nanotube (CNT) nanoparticles, which are well-formulated to achieve optimal rheological properties for 3D printing. The resulting 3D-printed frame exhibits an ultralight structure (0.076 g cm⁻³) and high EMI shielding effectiveness (61.4 dB), along with a superhigh specific shielding value (802.4 dB cm⁻³ g⁻¹). The module is in situ integrated onto electronics, offering multiple functions of electromagnetic compatibility and thermal dissipation. The 3D-printed conformal shielding (c-SE) module is designed to replace traditional metal-based modules, providing a lightweight, strong, and adaptable solution for EMI shielding in integrated electronics. The module demonstrates excellent EMI shielding performance across a wide frequency range, with total shielding values exceeding 30 dB, meeting commercial standards. Additionally, the module exhibits efficient thermal management capabilities, with improved thermal dissipation compared to traditional packaging materials. The study highlights the potential of 3D-printed carbon-based materials for next-generation EMI shielding solutions, offering a promising approach for lightweight, high-performance, and customizable shielding modules in integrated electronics.This article presents a novel 3D-printed carbon-based conformal electromagnetic interference (EMI) shielding module for integrated electronics. The module is fabricated using functional inks containing graphene and carbon nanotube (CNT) nanoparticles, which are well-formulated to achieve optimal rheological properties for 3D printing. The resulting 3D-printed frame exhibits an ultralight structure (0.076 g cm⁻³) and high EMI shielding effectiveness (61.4 dB), along with a superhigh specific shielding value (802.4 dB cm⁻³ g⁻¹). The module is in situ integrated onto electronics, offering multiple functions of electromagnetic compatibility and thermal dissipation. The 3D-printed conformal shielding (c-SE) module is designed to replace traditional metal-based modules, providing a lightweight, strong, and adaptable solution for EMI shielding in integrated electronics. The module demonstrates excellent EMI shielding performance across a wide frequency range, with total shielding values exceeding 30 dB, meeting commercial standards. Additionally, the module exhibits efficient thermal management capabilities, with improved thermal dissipation compared to traditional packaging materials. The study highlights the potential of 3D-printed carbon-based materials for next-generation EMI shielding solutions, offering a promising approach for lightweight, high-performance, and customizable shielding modules in integrated electronics.