A 3D-printed carbon-based conformal electromagnetic interference (EMI) shielding module for integrated electronics is introduced, offering high-performance EMI shielding with an ultralight structure and excellent thermal management capabilities. The module is fabricated using 3D printable inks containing graphene and carbon nanotube (CNT) nanoparticles, which are well-formulated to achieve optimal rheological properties for direct ink writing (DIW) 3D printing. The resulting 3D-printed frames exhibit an EMI shielding efficiency of 61.4 dB, with a specific shielding efficiency of 802.4 dB cm³ g⁻¹, far exceeding previously reported materials. The module is integrated directly onto core electronics, enabling multiple functions of electromagnetic compatibility and thermal dissipation without occupying additional space. The module's ultralight architecture (0.076 g cm⁻³) and high-performance shielding capabilities make it suitable for next-generation integrated electronics. The 3D-printed conformal shielding (c-SE) module demonstrates excellent EMI shielding performance in the 2.0–6.0 GHz frequency range, with total shielding values exceeding 30 dB. Additionally, the module exhibits efficient thermal dissipation, with a maximal working-temperature difference of ~9°C when integrated with packaging materials. The module's unique design and fabrication method offer promising potential for future high-performance EMI shielding materials in integrated electronics.A 3D-printed carbon-based conformal electromagnetic interference (EMI) shielding module for integrated electronics is introduced, offering high-performance EMI shielding with an ultralight structure and excellent thermal management capabilities. The module is fabricated using 3D printable inks containing graphene and carbon nanotube (CNT) nanoparticles, which are well-formulated to achieve optimal rheological properties for direct ink writing (DIW) 3D printing. The resulting 3D-printed frames exhibit an EMI shielding efficiency of 61.4 dB, with a specific shielding efficiency of 802.4 dB cm³ g⁻¹, far exceeding previously reported materials. The module is integrated directly onto core electronics, enabling multiple functions of electromagnetic compatibility and thermal dissipation without occupying additional space. The module's ultralight architecture (0.076 g cm⁻³) and high-performance shielding capabilities make it suitable for next-generation integrated electronics. The 3D-printed conformal shielding (c-SE) module demonstrates excellent EMI shielding performance in the 2.0–6.0 GHz frequency range, with total shielding values exceeding 30 dB. Additionally, the module exhibits efficient thermal dissipation, with a maximal working-temperature difference of ~9°C when integrated with packaging materials. The module's unique design and fabrication method offer promising potential for future high-performance EMI shielding materials in integrated electronics.