The adoption of three-dimensional (3D) integration has revolutionized NAND flash memory technology, and similar transformative potential exists for logic circuits by stacking transistors in the third dimension. This shift towards 3D integration of logic circuits is driven by advancements in silicon device structures and their scaling. However, advanced scaling requires ultrathin semiconducting channels, which are challenging to achieve with silicon. Field-effect transistors based on two-dimensional (2D) semiconductors have gained attention due to their atomically thin nature and impressive performance. 2D materials offer broader functionalities, such as optical, chemical, and biological sensing, extending their utility beyond simple dimensional scaling and enabling the development of 'more than Moore' technologies. This review explores the progress, challenges, and future opportunities for 3D integration of 2D electronics, highlighting the need for synergistic research in material synthesis and device integration strategies. Key challenges include material synthesis, transfer processes, threshold voltage engineering, yield and variability, dielectric integration, and device performance. Despite these challenges, recent advancements in 3D integration of 2D electronics have demonstrated the potential for multifunctional chips and sustainable, energy-efficient computing systems.The adoption of three-dimensional (3D) integration has revolutionized NAND flash memory technology, and similar transformative potential exists for logic circuits by stacking transistors in the third dimension. This shift towards 3D integration of logic circuits is driven by advancements in silicon device structures and their scaling. However, advanced scaling requires ultrathin semiconducting channels, which are challenging to achieve with silicon. Field-effect transistors based on two-dimensional (2D) semiconductors have gained attention due to their atomically thin nature and impressive performance. 2D materials offer broader functionalities, such as optical, chemical, and biological sensing, extending their utility beyond simple dimensional scaling and enabling the development of 'more than Moore' technologies. This review explores the progress, challenges, and future opportunities for 3D integration of 2D electronics, highlighting the need for synergistic research in material synthesis and device integration strategies. Key challenges include material synthesis, transfer processes, threshold voltage engineering, yield and variability, dielectric integration, and device performance. Despite these challenges, recent advancements in 3D integration of 2D electronics have demonstrated the potential for multifunctional chips and sustainable, energy-efficient computing systems.