This review focuses on the transfer techniques for two-dimensional (2D) materials, which are essential for their integration into various electronic and optoelectronic devices. The methods discussed include wet transfer, dry transfer, mechanical exfoliation, and metal-assisted transfer. Wet transfer techniques, such as chemical etching and electrochemical bubbling, are widely used for transferring 2D materials like graphene, molybdenum disulfide (MoS₂), and hexagonal boron nitride (hBN) from growth substrates to target substrates. Chemical etching involves using a polymer layer (e.g., PMMA) and a chemical etchant to detach the 2D material from the growth substrate, while electrochemical bubbling uses hydrogen bubbles to achieve non-destructive detachment. Dry transfer techniques, such as chemical etchant-assisted dry transfer and mechanical exfoliation, do not require an aqueous environment and rely on the adhesion between the 2D material and the target substrate. Mechanical exfoliation involves placing an adhesive layer on the 2D material and peeling it off, followed by transferring it to the target substrate. The review also highlights the advantages and limitations of each technique, emphasizing the importance of minimizing defects and optimizing the transfer process for high-quality 2D materials.This review focuses on the transfer techniques for two-dimensional (2D) materials, which are essential for their integration into various electronic and optoelectronic devices. The methods discussed include wet transfer, dry transfer, mechanical exfoliation, and metal-assisted transfer. Wet transfer techniques, such as chemical etching and electrochemical bubbling, are widely used for transferring 2D materials like graphene, molybdenum disulfide (MoS₂), and hexagonal boron nitride (hBN) from growth substrates to target substrates. Chemical etching involves using a polymer layer (e.g., PMMA) and a chemical etchant to detach the 2D material from the growth substrate, while electrochemical bubbling uses hydrogen bubbles to achieve non-destructive detachment. Dry transfer techniques, such as chemical etchant-assisted dry transfer and mechanical exfoliation, do not require an aqueous environment and rely on the adhesion between the 2D material and the target substrate. Mechanical exfoliation involves placing an adhesive layer on the 2D material and peeling it off, followed by transferring it to the target substrate. The review also highlights the advantages and limitations of each technique, emphasizing the importance of minimizing defects and optimizing the transfer process for high-quality 2D materials.