This review summarizes the transfer methods for two-dimensional (2D) materials, focusing on techniques to transfer these materials from their growth substrates to target substrates. The unique properties of 2D materials, such as graphene and transition metal dichalcogenides (TMDs), make them promising candidates for applications in electronics, optoelectronics, and sensors. However, their synthesis often requires high temperatures and specific conditions, making direct integration into devices challenging. Therefore, transfer techniques are essential to minimize defects and ensure high-quality material transfer. Wet transfer methods, such as chemical etching and electrochemical bubbling, are widely used. Chemical etching involves using a polymer layer (e.g., PMMA) to protect the 2D material during transfer, followed by etching the growth substrate to detach the material. Electrochemical bubbling uses an aqueous solution and an applied voltage to generate bubbles that lift the 2D material from the substrate. These methods are effective but can introduce defects or residues. Dry transfer techniques, including mechanical exfoliation and the use of compliant layers, offer alternatives that avoid aqueous environments. Mechanical exfoliation relies on the adhesion properties of the 2D material to different substrates, allowing for the removal of the material without chemical etching. Compliant layers, such as PDMS or PSAF, provide support during transfer and can be removed after the material is transferred to the target substrate. Other methods, such as the wet capillary method, utilize capillary forces to transfer materials, often involving hydrophobic and hydrophilic interactions. This method is effective for materials like WS₂ and MoS₂, enabling their transfer to various substrates with minimal damage. The review highlights the importance of minimizing defects and preserving the intrinsic properties of 2D materials during transfer. Various techniques have been developed to achieve this, with ongoing research aimed at improving efficiency and scalability. The choice of transfer method depends on the specific material, target substrate, and desired application. Overall, these transfer techniques are crucial for the practical implementation of 2D materials in electronic and optoelectronic devices.This review summarizes the transfer methods for two-dimensional (2D) materials, focusing on techniques to transfer these materials from their growth substrates to target substrates. The unique properties of 2D materials, such as graphene and transition metal dichalcogenides (TMDs), make them promising candidates for applications in electronics, optoelectronics, and sensors. However, their synthesis often requires high temperatures and specific conditions, making direct integration into devices challenging. Therefore, transfer techniques are essential to minimize defects and ensure high-quality material transfer. Wet transfer methods, such as chemical etching and electrochemical bubbling, are widely used. Chemical etching involves using a polymer layer (e.g., PMMA) to protect the 2D material during transfer, followed by etching the growth substrate to detach the material. Electrochemical bubbling uses an aqueous solution and an applied voltage to generate bubbles that lift the 2D material from the substrate. These methods are effective but can introduce defects or residues. Dry transfer techniques, including mechanical exfoliation and the use of compliant layers, offer alternatives that avoid aqueous environments. Mechanical exfoliation relies on the adhesion properties of the 2D material to different substrates, allowing for the removal of the material without chemical etching. Compliant layers, such as PDMS or PSAF, provide support during transfer and can be removed after the material is transferred to the target substrate. Other methods, such as the wet capillary method, utilize capillary forces to transfer materials, often involving hydrophobic and hydrophilic interactions. This method is effective for materials like WS₂ and MoS₂, enabling their transfer to various substrates with minimal damage. The review highlights the importance of minimizing defects and preserving the intrinsic properties of 2D materials during transfer. Various techniques have been developed to achieve this, with ongoing research aimed at improving efficiency and scalability. The choice of transfer method depends on the specific material, target substrate, and desired application. Overall, these transfer techniques are crucial for the practical implementation of 2D materials in electronic and optoelectronic devices.