This paper presents a novel, wearable, and highly sensitive pressure sensor fabricated using ultrathin gold nanowires (AuNWs). The sensor is constructed by sandwiching AuNW-impregnated tissue paper between two thin polydimethylsiloxane (PDMS) sheets. The fabrication process is scalable, enabling large-area integration and patterning for spatial pressure mapping. The sensor operates at a battery voltage of 1.5 V with low energy consumption (<30 μW) and can detect forces as low as 13 Pa with a fast response time (<17 ms), high sensitivity (>1.14 kPa−1), and high stability (>50,000 loading-unloading cycles). It can resolve various types of mechanical forces, including pressing, bending, torsion, and acoustic vibrations. The sensor's superior performance, combined with its mechanical flexibility and robustness, allows for real-time monitoring of blood pulses and detection of small vibration forces from music. The fabrication method is also scalable and cost-effective, making it suitable for integration into future wearable electronics.This paper presents a novel, wearable, and highly sensitive pressure sensor fabricated using ultrathin gold nanowires (AuNWs). The sensor is constructed by sandwiching AuNW-impregnated tissue paper between two thin polydimethylsiloxane (PDMS) sheets. The fabrication process is scalable, enabling large-area integration and patterning for spatial pressure mapping. The sensor operates at a battery voltage of 1.5 V with low energy consumption (<30 μW) and can detect forces as low as 13 Pa with a fast response time (<17 ms), high sensitivity (>1.14 kPa−1), and high stability (>50,000 loading-unloading cycles). It can resolve various types of mechanical forces, including pressing, bending, torsion, and acoustic vibrations. The sensor's superior performance, combined with its mechanical flexibility and robustness, allows for real-time monitoring of blood pulses and detection of small vibration forces from music. The fabrication method is also scalable and cost-effective, making it suitable for integration into future wearable electronics.