This review presents an overview of recent advancements in dielectric resonator antenna (DRA) technology for 5G and 6G applications. The paper discusses various DRA designs, focusing on their applicability in array configurations for millimeter-wave (mmW) bands. Off-chip DRA designs, including in-substrate and compact DRAs, have gained popularity due to the development of cost-effective multilayer laminate manufacturing techniques such as printed circuit boards (PCBs) and low-temperature co-fired ceramic (LTCC). DRAs offer advantages such as lower conductive losses and greater flexibility in shapes and materials. The paper compares the performance of different DRA designs, considering material usage, manufacturing feasibility, overall performance, and applications. It also explores beam-steerable, dual-band, and on-chip alignment capabilities of DRAs, which provide versatile alternatives to traditional lossy printed antennas. The review highlights the potential of DRAs in high-frequency applications such as mmW and beyond. The paper discusses various DRA designs, including compact off-chip DRAs, on-chip DRAs, beam-steerable DRAs, and dual-band DRAs. It also addresses the challenges and opportunities in the development of DRAs for 5G and 6G applications. The review concludes that DRAs are promising alternatives to traditional antennas due to their high efficiency, compact size, and versatility in design. The paper emphasizes the importance of material selection, manufacturing techniques, and performance optimization in the development of DRAs for future communication systems.This review presents an overview of recent advancements in dielectric resonator antenna (DRA) technology for 5G and 6G applications. The paper discusses various DRA designs, focusing on their applicability in array configurations for millimeter-wave (mmW) bands. Off-chip DRA designs, including in-substrate and compact DRAs, have gained popularity due to the development of cost-effective multilayer laminate manufacturing techniques such as printed circuit boards (PCBs) and low-temperature co-fired ceramic (LTCC). DRAs offer advantages such as lower conductive losses and greater flexibility in shapes and materials. The paper compares the performance of different DRA designs, considering material usage, manufacturing feasibility, overall performance, and applications. It also explores beam-steerable, dual-band, and on-chip alignment capabilities of DRAs, which provide versatile alternatives to traditional lossy printed antennas. The review highlights the potential of DRAs in high-frequency applications such as mmW and beyond. The paper discusses various DRA designs, including compact off-chip DRAs, on-chip DRAs, beam-steerable DRAs, and dual-band DRAs. It also addresses the challenges and opportunities in the development of DRAs for 5G and 6G applications. The review concludes that DRAs are promising alternatives to traditional antennas due to their high efficiency, compact size, and versatility in design. The paper emphasizes the importance of material selection, manufacturing techniques, and performance optimization in the development of DRAs for future communication systems.