A chemical modification-free diffusion-induced cohesion (DIC) strategy is reported to achieve strong interfacial binding between inert gold (Au) and waterborne polyurethane (WPU) for anti-friction electronics. By constructing a nanoscale rough configuration of WPU (RPU), the interfacial binding strength of the Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane (PDMS) and styrene-ethylene-butylene-styrene (SEBS)-based devices, respectively. The stretchable Au-RPU device maintains good electrical conductivity after 1022 frictions at 130 kPa pressure and reliably records high-fidelity electrophysiological signals. An anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating superior mechanical durability for concentrated large pressure acquisition. This approach enables three-dimensional integration and on-chip interconnection for stretchable electronics. The Au-RPU device exhibits strong interfacial binding due to hydrogen bonding between diffused water molecules and oxygen-containing groups on the WPU surface. The device maintains high conductivity even after 1022 frictions and can stretch to 400% strain with low resistivity. The Au-RPU device is used to fabricate stretchable electrodes for electrophysiological signal recording and a pressure sensor array for monitoring concentrated forces. The device shows excellent anti-friction ability, maintaining conductivity even after strong cyclic rubbing by fabrics, hairy scalp, and skin. The Au-RPU device also exhibits good electrical stability and mechanical durability under various deformations. The results demonstrate the potential of the DIC strategy for robust human-machine interfaces (HMIs) and wearable electronics.A chemical modification-free diffusion-induced cohesion (DIC) strategy is reported to achieve strong interfacial binding between inert gold (Au) and waterborne polyurethane (WPU) for anti-friction electronics. By constructing a nanoscale rough configuration of WPU (RPU), the interfacial binding strength of the Au-RPU device increases to 1243.4 N/m, which is 100 and 4 times higher than that of conventional polydimethylsiloxane (PDMS) and styrene-ethylene-butylene-styrene (SEBS)-based devices, respectively. The stretchable Au-RPU device maintains good electrical conductivity after 1022 frictions at 130 kPa pressure and reliably records high-fidelity electrophysiological signals. An anti-friction pressure sensor array is constructed based on Au-RPU interconnect wires, demonstrating superior mechanical durability for concentrated large pressure acquisition. This approach enables three-dimensional integration and on-chip interconnection for stretchable electronics. The Au-RPU device exhibits strong interfacial binding due to hydrogen bonding between diffused water molecules and oxygen-containing groups on the WPU surface. The device maintains high conductivity even after 1022 frictions and can stretch to 400% strain with low resistivity. The Au-RPU device is used to fabricate stretchable electrodes for electrophysiological signal recording and a pressure sensor array for monitoring concentrated forces. The device shows excellent anti-friction ability, maintaining conductivity even after strong cyclic rubbing by fabrics, hairy scalp, and skin. The Au-RPU device also exhibits good electrical stability and mechanical durability under various deformations. The results demonstrate the potential of the DIC strategy for robust human-machine interfaces (HMIs) and wearable electronics.