The article presents a novel strategy for enhancing the interfacial cohesion between gold (Au) and elastomers, specifically polyurethane (PU), to create anti-friction stretchable electronics. The method involves using hydrophilic PU to wet Au grains, forming strong hydrogen bonds that increase the interfacial binding strength from 1017.6 N/m to 1243.4 N/m. This improvement is achieved by constructing a nanoscale rough configuration of the PU, which further enhances the device's mechanical durability. The Au-PU device maintains high electrical conductivity even after 1022 frictions at 130 kPa pressure and can reliably record high-fidelity electrophysiological signals. The authors also demonstrate the device's application in a pressure sensor array, showing superior mechanical durability for concentrated large pressure acquisition. The chemical modification-free approach of interfacial strengthening is promising for three-dimensional integration and on-chip interconnection in stretchable electronics.The article presents a novel strategy for enhancing the interfacial cohesion between gold (Au) and elastomers, specifically polyurethane (PU), to create anti-friction stretchable electronics. The method involves using hydrophilic PU to wet Au grains, forming strong hydrogen bonds that increase the interfacial binding strength from 1017.6 N/m to 1243.4 N/m. This improvement is achieved by constructing a nanoscale rough configuration of the PU, which further enhances the device's mechanical durability. The Au-PU device maintains high electrical conductivity even after 1022 frictions at 130 kPa pressure and can reliably record high-fidelity electrophysiological signals. The authors also demonstrate the device's application in a pressure sensor array, showing superior mechanical durability for concentrated large pressure acquisition. The chemical modification-free approach of interfacial strengthening is promising for three-dimensional integration and on-chip interconnection in stretchable electronics.