Computer Simulation of Ion–Solid Interactions

Computer Simulation of Ion–Solid Interactions

May 1991 | Wolfgang Eckstein
The Springer Series in Materials Science is a collection of books edited by various experts in the field, covering a wide range of topics in materials science. The series includes volumes on chemical processing with lasers, laser interactions with materials, laser processing of thin films and microstructures, microclusters, graphite fibers and filaments, elemental and molecular clusters, molecular beam epitaxy, physical chemistry of silicon, tritium and helium-3 in metals, computer simulation of ion-solid interactions, mechanisms of high-temperature superconductivity, dislocation dynamics and plasticity, semiconductor silicon, graphite intercalation compounds, crystal chemistry of high-Tc superconducting copper oxides, hydrogen in semiconductors, ordering at surfaces and interfaces, and laser-assisted microtechnology. One of the volumes, "Computer Simulation of Ion-Solid Interactions," authored by Dr. Wolfgang Eckstein, focuses on the computer simulation of processes involving the interaction of projectiles with solid surfaces. The book covers the penetration, backscattering, transmission, sputtering, and damage creation of atomic particles in amorphous, crystalline, or polycrystalline solids. It discusses both binary collision approximation and molecular dynamics models, interaction potentials, and inelastic energy losses. The book is intended for advanced students and researchers in physics and materials science, providing a comprehensive overview of the relevant collision processes and their applications in various fields such as semiconductor implantation, surface analysis, thin film production, and plasma technology.The Springer Series in Materials Science is a collection of books edited by various experts in the field, covering a wide range of topics in materials science. The series includes volumes on chemical processing with lasers, laser interactions with materials, laser processing of thin films and microstructures, microclusters, graphite fibers and filaments, elemental and molecular clusters, molecular beam epitaxy, physical chemistry of silicon, tritium and helium-3 in metals, computer simulation of ion-solid interactions, mechanisms of high-temperature superconductivity, dislocation dynamics and plasticity, semiconductor silicon, graphite intercalation compounds, crystal chemistry of high-Tc superconducting copper oxides, hydrogen in semiconductors, ordering at surfaces and interfaces, and laser-assisted microtechnology. One of the volumes, "Computer Simulation of Ion-Solid Interactions," authored by Dr. Wolfgang Eckstein, focuses on the computer simulation of processes involving the interaction of projectiles with solid surfaces. The book covers the penetration, backscattering, transmission, sputtering, and damage creation of atomic particles in amorphous, crystalline, or polycrystalline solids. It discusses both binary collision approximation and molecular dynamics models, interaction potentials, and inelastic energy losses. The book is intended for advanced students and researchers in physics and materials science, providing a comprehensive overview of the relevant collision processes and their applications in various fields such as semiconductor implantation, surface analysis, thin film production, and plasma technology.
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