A universal crosslinking-induced patterning method for metal-organic frameworks (MOFs), termed CLIP-MOF, enables high-resolution, scalable, and multimaterial patterning of various MOFs on rigid and flexible substrates. This method uses direct photo- and electron-beam (e-beam) lithography without resists, leveraging the ligand crosslinking chemistry of colloidal MOF nanoparticles (NPs). Crosslinkers, such as bisPFPA, are added to MOF NP solutions, where UV or e-beam irradiation triggers covalent bonding between surface ligands, leading to crosslinked networks that are insoluble in developer solvents. This allows selective removal of unexposed MOF films, enabling micro- and nanoscale patterning with resolutions of ~5 µm and ~70 nm, respectively. CLIP-MOF preserves the crystallinity, porosity, and other properties of MOFs, making them suitable for applications such as diffractive gas sensors and electrochromic pixels. The method is compatible with a wide range of MOFs with diverse chemistries, structures, and functionalities, offering scalable, precise, and non-destructive patterning. CLIP-MOF enables layer-by-layer, multimaterial patterning of MOFs, with applications in microelectronics, nanophotonics, lab-on-chip sensing, and biomedical devices. The method also supports nanoscale patterning via e-beam lithography, achieving sub-50 nm resolution with low e-beam doses. CLIP-MOF preserves the structural and functional properties of MOFs, making them suitable for applications such as photonic vapor sensors and electrochromic devices. The method is versatile, scalable, and adaptable to various MOF types, offering a promising approach for integrating MOFs in solid-state devices.A universal crosslinking-induced patterning method for metal-organic frameworks (MOFs), termed CLIP-MOF, enables high-resolution, scalable, and multimaterial patterning of various MOFs on rigid and flexible substrates. This method uses direct photo- and electron-beam (e-beam) lithography without resists, leveraging the ligand crosslinking chemistry of colloidal MOF nanoparticles (NPs). Crosslinkers, such as bisPFPA, are added to MOF NP solutions, where UV or e-beam irradiation triggers covalent bonding between surface ligands, leading to crosslinked networks that are insoluble in developer solvents. This allows selective removal of unexposed MOF films, enabling micro- and nanoscale patterning with resolutions of ~5 µm and ~70 nm, respectively. CLIP-MOF preserves the crystallinity, porosity, and other properties of MOFs, making them suitable for applications such as diffractive gas sensors and electrochromic pixels. The method is compatible with a wide range of MOFs with diverse chemistries, structures, and functionalities, offering scalable, precise, and non-destructive patterning. CLIP-MOF enables layer-by-layer, multimaterial patterning of MOFs, with applications in microelectronics, nanophotonics, lab-on-chip sensing, and biomedical devices. The method also supports nanoscale patterning via e-beam lithography, achieving sub-50 nm resolution with low e-beam doses. CLIP-MOF preserves the structural and functional properties of MOFs, making them suitable for applications such as photonic vapor sensors and electrochromic devices. The method is versatile, scalable, and adaptable to various MOF types, offering a promising approach for integrating MOFs in solid-state devices.