A new all-dry method for deterministic transfer of two-dimensional (2D) materials using viscoelastic stamps is introduced. This method avoids wet chemistry and capillary forces, enabling the precise placement of 2D crystals on arbitrary substrates. The viscoelastic stamp, made from a commercially available material, allows for the transfer of atomically thin layers of materials such as graphene, boron nitride, molybdenum disulfide, and mica. The process involves mechanical exfoliation of bulk materials, followed by transfer onto the stamp, and then careful alignment and peeling of the stamp to transfer the material to the target substrate. The method is efficient, clean, and can be performed with high yield, making it suitable for fabricating complex heterostructures and freely suspended 2D layers. The technique is demonstrated with examples of heterostructures formed by stacking different 2D materials, including a sandwiched MoS₂ bilayer between two h-BN flakes. The method also enables the transfer of 2D materials onto fragile substrates such as AFM cantilevers, silicon nitride membranes, and holey carbon films. The process is fast, with the entire transfer completed in under 15 minutes, and the fabricated structures are free of bubbles and wrinkles. The method offers significant advantages over traditional wet transfer techniques, including reduced contamination and the ability to fabricate structures on sensitive substrates. The all-dry transfer method is a promising approach for the fabrication of 2D-based devices and heterostructures in nanotechnology.A new all-dry method for deterministic transfer of two-dimensional (2D) materials using viscoelastic stamps is introduced. This method avoids wet chemistry and capillary forces, enabling the precise placement of 2D crystals on arbitrary substrates. The viscoelastic stamp, made from a commercially available material, allows for the transfer of atomically thin layers of materials such as graphene, boron nitride, molybdenum disulfide, and mica. The process involves mechanical exfoliation of bulk materials, followed by transfer onto the stamp, and then careful alignment and peeling of the stamp to transfer the material to the target substrate. The method is efficient, clean, and can be performed with high yield, making it suitable for fabricating complex heterostructures and freely suspended 2D layers. The technique is demonstrated with examples of heterostructures formed by stacking different 2D materials, including a sandwiched MoS₂ bilayer between two h-BN flakes. The method also enables the transfer of 2D materials onto fragile substrates such as AFM cantilevers, silicon nitride membranes, and holey carbon films. The process is fast, with the entire transfer completed in under 15 minutes, and the fabricated structures are free of bubbles and wrinkles. The method offers significant advantages over traditional wet transfer techniques, including reduced contamination and the ability to fabricate structures on sensitive substrates. The all-dry transfer method is a promising approach for the fabrication of 2D-based devices and heterostructures in nanotechnology.