This review summarizes recent research on electroplating additives for advanced packaging, focusing on their roles in improving copper interconnect quality. Acid copper electroplating is crucial for creating metal interconnects, bumps, vias, and substrate wiring in advanced packaging. The quality of copper interconnects significantly impacts chip performance, yield, reliability, and stability. Additives, such as accelerators, inhibitors, and leveling agents, play a key role in regulating deposition quality and behavior during electroplating. The review discusses the types and mechanisms of these additives, their interactions, and challenges in acid copper electroplating. It highlights the importance of additives in achieving uniform, fine, and bright copper coatings, and explores current issues such as the need for more efficient and environmentally friendly additives. The review also proposes potential solutions and research directions for improving electroplating processes. The development of copper electroplating additives is essential for advancing advanced packaging technology, with a focus on low-toxicity, environmentally friendly, and high-performance additives. The review emphasizes the need for further research into the electrochemical behavior of additives and their impact on copper coating properties. The study concludes that the development of effective electroplating additives is crucial for achieving independent chip localization and meeting the demands of advanced packaging technology.This review summarizes recent research on electroplating additives for advanced packaging, focusing on their roles in improving copper interconnect quality. Acid copper electroplating is crucial for creating metal interconnects, bumps, vias, and substrate wiring in advanced packaging. The quality of copper interconnects significantly impacts chip performance, yield, reliability, and stability. Additives, such as accelerators, inhibitors, and leveling agents, play a key role in regulating deposition quality and behavior during electroplating. The review discusses the types and mechanisms of these additives, their interactions, and challenges in acid copper electroplating. It highlights the importance of additives in achieving uniform, fine, and bright copper coatings, and explores current issues such as the need for more efficient and environmentally friendly additives. The review also proposes potential solutions and research directions for improving electroplating processes. The development of copper electroplating additives is essential for advancing advanced packaging technology, with a focus on low-toxicity, environmentally friendly, and high-performance additives. The review emphasizes the need for further research into the electrochemical behavior of additives and their impact on copper coating properties. The study concludes that the development of effective electroplating additives is crucial for achieving independent chip localization and meeting the demands of advanced packaging technology.