The article "Electroplated Copper Additives for Advanced Packaging: A Review" by Lanfeng Guo et al. provides a comprehensive overview of the role of electroplated copper additives in advanced packaging processes. The deposition quality of copper interconnect materials is crucial for the performance, yield, reliability, and stability of chips. Additives play a pivotal role in regulating the deposition quality and behavior of metal copper, including accelerators, inhibitors, and leveling agents. The review delves into the types and mechanisms of these additives, highlighting their specific roles and interaction mechanisms. It also discusses the current issues and challenges in acid copper electroplating, such as the incomplete understanding of additive mechanisms and the need for new additive systems at higher current densities. The authors propose several potential solutions and research directions, emphasizing the development of low-toxicity, environmentally friendly, and stable additives. The review aims to promote the advancement of advanced packaging technology by providing a deep understanding of the development and application of electroplated copper additives.The article "Electroplated Copper Additives for Advanced Packaging: A Review" by Lanfeng Guo et al. provides a comprehensive overview of the role of electroplated copper additives in advanced packaging processes. The deposition quality of copper interconnect materials is crucial for the performance, yield, reliability, and stability of chips. Additives play a pivotal role in regulating the deposition quality and behavior of metal copper, including accelerators, inhibitors, and leveling agents. The review delves into the types and mechanisms of these additives, highlighting their specific roles and interaction mechanisms. It also discusses the current issues and challenges in acid copper electroplating, such as the incomplete understanding of additive mechanisms and the need for new additive systems at higher current densities. The authors propose several potential solutions and research directions, emphasizing the development of low-toxicity, environmentally friendly, and stable additives. The review aims to promote the advancement of advanced packaging technology by providing a deep understanding of the development and application of electroplated copper additives.