The IEEE Transactions on Materials for Electron Devices (T-MAT) is a journal that focuses on the application and fundamentals of electronic materials and their interconnects. It aims to bring together academics and industrial scientists to explore novel materials that can address current and future challenges in electron devices. The journal publishes contributed and invited articles in various formats, covering a wide range of topics including advanced thin-films, nanomaterials, and manufacturing technologies. Topics of interest include scalability, large-scale structuring and patterning, interface control, integrated performance, reliability, and sustainability in semiconductor manufacturing. The journal is set to launch in 2024 and invites submissions of manuscripts through the IEEE Atypon Rex platform. The editorial board includes prominent researchers from universities and industry, such as Prof. Francesca Iacopi, Prof. Paul Berger, and Dr. Marko Radosavljevic. The journal is supported by the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society, with additional contributions from experts in various fields. The journal emphasizes the development of materials and manufacturing techniques that can optimize performance for specific applications while ensuring long-term sustainability in semiconductor manufacturing.The IEEE Transactions on Materials for Electron Devices (T-MAT) is a journal that focuses on the application and fundamentals of electronic materials and their interconnects. It aims to bring together academics and industrial scientists to explore novel materials that can address current and future challenges in electron devices. The journal publishes contributed and invited articles in various formats, covering a wide range of topics including advanced thin-films, nanomaterials, and manufacturing technologies. Topics of interest include scalability, large-scale structuring and patterning, interface control, integrated performance, reliability, and sustainability in semiconductor manufacturing. The journal is set to launch in 2024 and invites submissions of manuscripts through the IEEE Atypon Rex platform. The editorial board includes prominent researchers from universities and industry, such as Prof. Francesca Iacopi, Prof. Paul Berger, and Dr. Marko Radosavljevic. The journal is supported by the IEEE Ultrasonics, Ferroelectrics, and Frequency Control Society, with additional contributions from experts in various fields. The journal emphasizes the development of materials and manufacturing techniques that can optimize performance for specific applications while ensuring long-term sustainability in semiconductor manufacturing.