This study presents a method for enhancing condensation heat transfer using scalable superhydrophobic nanostructured surfaces. Researchers at MIT demonstrate that silanized copper oxide (CuO) surfaces, created via a simple fabrication method, can achieve highly efficient jumping-droplet condensation. The CuO surfaces allow for faster droplet removal and significantly enhance heat transfer performance compared to conventional dropwise condensing copper (Cu) surfaces. The study shows a 25% higher overall heat flux and 30% higher condensation heat transfer coefficient at low supersaturations (<1.12) compared to state-of-the-art hydrophobic condensing surfaces. The key mechanism behind this enhancement is the "jumping" of droplets, which occurs when small droplets merge on the superhydrophobic surface and release excess surface energy, causing them to jump off the surface. This process increases the time-averaged density of small droplets, which transfer heat more efficiently from the vapor to the substrate. The CuO surfaces are designed to minimize droplet adhesion and break the symmetry of the coalesced droplet, enabling the droplet to accelerate and depart perpendicular to the surface. The study also highlights the importance of surface structure and vapor pressure in determining condensation performance. The CuO surfaces, with their nanostructured features, provide a low parasitic conduction thermal resistance and promote the formation of partially wetting droplets, which are essential for minimizing individual droplet thermal resistance. The results show that the CuO surfaces offer ideal condensation behavior in terms of droplet morphology and coalescence dynamics, and a significant enhancement in heat transfer performance compared to state-of-the-art condensing surfaces. The study also demonstrates that the CuO surfaces can sustain droplet jumping behavior, making them attractive for applications such as atmospheric water harvesting and dehumidification, where the heat fluxes are relatively low and droplets can be maintained in a highly mobile state. The results provide insights into the design of high flux superhydrophobic condensation surfaces and highlight the importance of operating conditions for condensation heat and mass transfer on nanostructured superhydrophobic surfaces. The study underscores the need for further reduction in structure scale and control of nucleation density at elevated supersaturations to improve the performance of these surfaces.This study presents a method for enhancing condensation heat transfer using scalable superhydrophobic nanostructured surfaces. Researchers at MIT demonstrate that silanized copper oxide (CuO) surfaces, created via a simple fabrication method, can achieve highly efficient jumping-droplet condensation. The CuO surfaces allow for faster droplet removal and significantly enhance heat transfer performance compared to conventional dropwise condensing copper (Cu) surfaces. The study shows a 25% higher overall heat flux and 30% higher condensation heat transfer coefficient at low supersaturations (<1.12) compared to state-of-the-art hydrophobic condensing surfaces. The key mechanism behind this enhancement is the "jumping" of droplets, which occurs when small droplets merge on the superhydrophobic surface and release excess surface energy, causing them to jump off the surface. This process increases the time-averaged density of small droplets, which transfer heat more efficiently from the vapor to the substrate. The CuO surfaces are designed to minimize droplet adhesion and break the symmetry of the coalesced droplet, enabling the droplet to accelerate and depart perpendicular to the surface. The study also highlights the importance of surface structure and vapor pressure in determining condensation performance. The CuO surfaces, with their nanostructured features, provide a low parasitic conduction thermal resistance and promote the formation of partially wetting droplets, which are essential for minimizing individual droplet thermal resistance. The results show that the CuO surfaces offer ideal condensation behavior in terms of droplet morphology and coalescence dynamics, and a significant enhancement in heat transfer performance compared to state-of-the-art condensing surfaces. The study also demonstrates that the CuO surfaces can sustain droplet jumping behavior, making them attractive for applications such as atmospheric water harvesting and dehumidification, where the heat fluxes are relatively low and droplets can be maintained in a highly mobile state. The results provide insights into the design of high flux superhydrophobic condensation surfaces and highlight the importance of operating conditions for condensation heat and mass transfer on nanostructured superhydrophobic surfaces. The study underscores the need for further reduction in structure scale and control of nucleation density at elevated supersaturations to improve the performance of these surfaces.