This study investigates the variation in mechanical properties of bulk Sylgard 184 polydimethylsiloxane (PDMS) with curing temperature, ranging from 25°C to 200°C. The mechanical properties tested include Young's modulus, ultimate tensile strength, compressive modulus, ultimate compressive strength, and hardness. PDMS samples were fabricated according to ASTM standards for tensile and compressive testing, and hardness testing was performed using a Durometer. The results show that the Young's modulus of Sylgard 184 increases linearly with curing temperature, doubling from 1.32 MPa at 25°C to 2.97 MPa at 200°C. The compressive modulus is approximately two orders of magnitude higher than the Young's modulus and decreases linearly with curing temperature, from 186.9 MPa at 25°C to 117.8 MPa at 200°C. The hardness of the samples also increases linearly with curing temperature. Additionally, the shear and bulk moduli were calculated using Poisson's ratio (0.499). The study provides quantitative data on the mechanical properties of Sylgard 184 as a function of curing temperature, which is essential for the design of microfluidic devices and microelectromechanical systems (MEMS). The significant difference between the tensile and compressive moduli of the cured samples should assist in the design of future devices employing PDMS materials in both compressive and tensile modes. The results highlight the importance of considering curing temperature when designing devices that use Sylgard 184 as a substrate material.This study investigates the variation in mechanical properties of bulk Sylgard 184 polydimethylsiloxane (PDMS) with curing temperature, ranging from 25°C to 200°C. The mechanical properties tested include Young's modulus, ultimate tensile strength, compressive modulus, ultimate compressive strength, and hardness. PDMS samples were fabricated according to ASTM standards for tensile and compressive testing, and hardness testing was performed using a Durometer. The results show that the Young's modulus of Sylgard 184 increases linearly with curing temperature, doubling from 1.32 MPa at 25°C to 2.97 MPa at 200°C. The compressive modulus is approximately two orders of magnitude higher than the Young's modulus and decreases linearly with curing temperature, from 186.9 MPa at 25°C to 117.8 MPa at 200°C. The hardness of the samples also increases linearly with curing temperature. Additionally, the shear and bulk moduli were calculated using Poisson's ratio (0.499). The study provides quantitative data on the mechanical properties of Sylgard 184 as a function of curing temperature, which is essential for the design of microfluidic devices and microelectromechanical systems (MEMS). The significant difference between the tensile and compressive moduli of the cured samples should assist in the design of future devices employing PDMS materials in both compressive and tensile modes. The results highlight the importance of considering curing temperature when designing devices that use Sylgard 184 as a substrate material.