Nanoimprint lithography (NIL) is a nonconventional lithographic technique that uses mechanical deformation of resist materials to create high-precision, high-throughput patterns at low costs. Unlike traditional lithographic methods, NIL does not rely on photons or electrons to modify the resist but instead relies on the direct mechanical deformation of the resist, allowing for resolutions beyond the limitations of conventional techniques. This review covers the basic principles of nanoimprinting, focusing on the requirements for the imprinting mold, surface properties, and resist materials to ensure successful and reliable nanostructure replication. The ability to fabricate structures from the micro- to the nanoscale with high precision is crucial for advancements in micro- and nanotechnology. NIL has demonstrated ultrahigh resolutions and high throughput, making it attractive for various applications, including electronics, photonics, data storage, and biotechnology. The process involves pressing a hard mold with nanoscale features into a polymeric material, creating a thickness contrast and a residual cushion layer to protect the mold's features. The mold can be made from materials like silicon, dielectrics, metals, or polymers, and the resist material should be deformable, hard, and have good mold-releasing properties. The mold used in NIL must have high strength and durability. Common materials include silicon, silicon dioxide, silicon nitride, metals, and polymers. The mold is typically fabricated using lithography techniques and reactive ion etching (RIE). Surface preparation is crucial to prevent adhesion of the imprinted polymer, often achieved through the formation of self-assembled monolayers or low-surface-energy coatings. Flexible fluoropolymers, such as Teflon AF, can also be used as molds due to their low surface energy and mechanical strength. The resist materials used in NIL must be easily deformable under pressure, have sufficient mechanical strength, and good mold-releasing properties. Thermal plastic resists are commonly used, but they require high temperatures and pressures, which can limit throughput and application scope. UV-curable resists, which can be cured at ambient temperatures, offer advantages in terms of lower temperatures, pressures, and faster processing times. These resists are often based on cationic polymerization of silicone epoxies or acrylic monomers and provide good etching resistance and uniform thin films. Recent developments in NIL have led to the exploration of new materials, such as siloxane copolymers and fast thermally curable liquid resists. Siloxane copolymers, with their low surface energy and high thermal stability, offer excellent mold-releasing properties and high-resolution feature production. Fast thermally curable liquid resists, based on hydrosilylation chemistry, provide high precision, high throughput, and good etching resistance, making them suitable for a wide range of applications. NIL has emerged as a promising technology for high-precision nanostructure fabrication, offering advantages over traditional lithographic techniques. The review highlights the key aspectsNanoimprint lithography (NIL) is a nonconventional lithographic technique that uses mechanical deformation of resist materials to create high-precision, high-throughput patterns at low costs. Unlike traditional lithographic methods, NIL does not rely on photons or electrons to modify the resist but instead relies on the direct mechanical deformation of the resist, allowing for resolutions beyond the limitations of conventional techniques. This review covers the basic principles of nanoimprinting, focusing on the requirements for the imprinting mold, surface properties, and resist materials to ensure successful and reliable nanostructure replication. The ability to fabricate structures from the micro- to the nanoscale with high precision is crucial for advancements in micro- and nanotechnology. NIL has demonstrated ultrahigh resolutions and high throughput, making it attractive for various applications, including electronics, photonics, data storage, and biotechnology. The process involves pressing a hard mold with nanoscale features into a polymeric material, creating a thickness contrast and a residual cushion layer to protect the mold's features. The mold can be made from materials like silicon, dielectrics, metals, or polymers, and the resist material should be deformable, hard, and have good mold-releasing properties. The mold used in NIL must have high strength and durability. Common materials include silicon, silicon dioxide, silicon nitride, metals, and polymers. The mold is typically fabricated using lithography techniques and reactive ion etching (RIE). Surface preparation is crucial to prevent adhesion of the imprinted polymer, often achieved through the formation of self-assembled monolayers or low-surface-energy coatings. Flexible fluoropolymers, such as Teflon AF, can also be used as molds due to their low surface energy and mechanical strength. The resist materials used in NIL must be easily deformable under pressure, have sufficient mechanical strength, and good mold-releasing properties. Thermal plastic resists are commonly used, but they require high temperatures and pressures, which can limit throughput and application scope. UV-curable resists, which can be cured at ambient temperatures, offer advantages in terms of lower temperatures, pressures, and faster processing times. These resists are often based on cationic polymerization of silicone epoxies or acrylic monomers and provide good etching resistance and uniform thin films. Recent developments in NIL have led to the exploration of new materials, such as siloxane copolymers and fast thermally curable liquid resists. Siloxane copolymers, with their low surface energy and high thermal stability, offer excellent mold-releasing properties and high-resolution feature production. Fast thermally curable liquid resists, based on hydrosilylation chemistry, provide high precision, high throughput, and good etching resistance, making them suitable for a wide range of applications. NIL has emerged as a promising technology for high-precision nanostructure fabrication, offering advantages over traditional lithographic techniques. The review highlights the key aspects