Rationale and Challenges for Optical Interconnects to Electronic Chips

Rationale and Challenges for Optical Interconnects to Electronic Chips

VOL. 88, NO. 6, JUNE 2000 | DAVID A. B. MILLER, FELLOW, IEEE
The paper discusses the rationale and challenges for introducing optical interconnects to silicon CMOS chips. It highlights that optics can address several physical problems of interconnects, such as precise clock distribution, system synchronization, bandwidth and density of long interconnections, and reduction of power dissipation. Optics may also simplify design issues like crosstalk, voltage isolation, wire reflection, impedance matching, and pin inductance. The paper emphasizes that no physical breakthrough is required to implement dense optical interconnects, but substantial technological work remains, particularly in terms of cost and integration. The author analyzes the scaling of on-chip global electrical interconnects, including line inductance and the skin effect, which impose significant constraints on future interconnects. The paper concludes by discussing the potential benefits of optics, such as scaling, timing, design simplification, and architectural advantages, and the challenges in implementing dense optical interconnects, including the need for low-power, small-latency, and high-density technologies.The paper discusses the rationale and challenges for introducing optical interconnects to silicon CMOS chips. It highlights that optics can address several physical problems of interconnects, such as precise clock distribution, system synchronization, bandwidth and density of long interconnections, and reduction of power dissipation. Optics may also simplify design issues like crosstalk, voltage isolation, wire reflection, impedance matching, and pin inductance. The paper emphasizes that no physical breakthrough is required to implement dense optical interconnects, but substantial technological work remains, particularly in terms of cost and integration. The author analyzes the scaling of on-chip global electrical interconnects, including line inductance and the skin effect, which impose significant constraints on future interconnects. The paper concludes by discussing the potential benefits of optics, such as scaling, timing, design simplification, and architectural advantages, and the challenges in implementing dense optical interconnects, including the need for low-power, small-latency, and high-density technologies.
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