Rationale and Challenges for Optical Interconnects to Electronic Chips

Rationale and Challenges for Optical Interconnects to Electronic Chips

JUNE 2000 | DAVID A. B. MILLER, FELLOW, IEEE
Optical interconnects to silicon chips offer significant advantages over electrical interconnects, addressing key challenges in scaling, timing, design, and architecture. Optical interconnects can overcome physical limitations of electrical interconnects, such as signal distortion, crosstalk, impedance matching, and power dissipation. They enable higher bandwidth, lower latency, and more efficient communication, especially for dense interconnects. Unlike electrical interconnects, optical interconnects are not limited by the "aspect ratio" of the line, allowing for higher data rates and better performance at higher clock speeds. They also avoid issues like inductance, skin effect, and capacitance, which become more pronounced as interconnects scale. Optical interconnects can support global synchronization, enabling larger synchronous zones on-chip and between chips. They are also less affected by temperature variations and can maintain timing accuracy over long distances. Additionally, optical interconnects can simplify design by avoiding electromagnetic wave phenomena such as impedance matching, crosstalk, and inductance. They are not limited by the distance of signal propagation, making them suitable for both short and long interconnects. However, implementing optical interconnects faces technical challenges, including the need for dense optical interconnects, low power dissipation, and integration with mainstream silicon electronics. While existing optical technologies are not optimized for dense interconnects, recent advancements in optoelectronic devices and integration techniques show promise. The paper discusses the potential benefits of optical interconnects, including improved bandwidth, reduced power consumption, and simplified design. It also highlights the challenges in scaling optical interconnects, including the need for high-speed, low-power devices and the integration of optical components with silicon circuits. Overall, optical interconnects offer a viable solution to the limitations of electrical interconnects, enabling more efficient and scalable digital processing systems.Optical interconnects to silicon chips offer significant advantages over electrical interconnects, addressing key challenges in scaling, timing, design, and architecture. Optical interconnects can overcome physical limitations of electrical interconnects, such as signal distortion, crosstalk, impedance matching, and power dissipation. They enable higher bandwidth, lower latency, and more efficient communication, especially for dense interconnects. Unlike electrical interconnects, optical interconnects are not limited by the "aspect ratio" of the line, allowing for higher data rates and better performance at higher clock speeds. They also avoid issues like inductance, skin effect, and capacitance, which become more pronounced as interconnects scale. Optical interconnects can support global synchronization, enabling larger synchronous zones on-chip and between chips. They are also less affected by temperature variations and can maintain timing accuracy over long distances. Additionally, optical interconnects can simplify design by avoiding electromagnetic wave phenomena such as impedance matching, crosstalk, and inductance. They are not limited by the distance of signal propagation, making them suitable for both short and long interconnects. However, implementing optical interconnects faces technical challenges, including the need for dense optical interconnects, low power dissipation, and integration with mainstream silicon electronics. While existing optical technologies are not optimized for dense interconnects, recent advancements in optoelectronic devices and integration techniques show promise. The paper discusses the potential benefits of optical interconnects, including improved bandwidth, reduced power consumption, and simplified design. It also highlights the challenges in scaling optical interconnects, including the need for high-speed, low-power devices and the integration of optical components with silicon circuits. Overall, optical interconnects offer a viable solution to the limitations of electrical interconnects, enabling more efficient and scalable digital processing systems.
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[slides and audio] Rationale and challenges for optical interconnects to electronic chips