Nanosupercapacitors, also known as electrochemical supercapacitors or nanocapacitors, are emerging as promising energy storage devices with extremely fast charge release rates. These devices are designed to enhance power execution and high-speed capability, but they still face inherent limitations. The electrical characteristics and manufacturing processes of nanocapacitors, particularly those using metal-insulator-carbon-metal nanotube layers, are discussed. These structures exhibit high capacitance and high integration density due to their unique nanotube structure. Electron beam lithography is used to create nanoscale patterns and high aspect ratios, making these vertical nanostructures suitable for applications in dynamic random access memory (DRAM) and various nanoelectronic devices. High voltage and high energy density are achieved through multilayer nanostructure technologies, and controlled sputtering techniques can deposit ultra-smooth submicron layers of dielectric and conductive materials. This technology can lead to significant improvements in energy density. Nano supercapacitors, with their solid structure and excellent mechanical and thermal properties, are expected to revolutionize industries such as nanoelectronics. They store 100 times more charge than electrolytic capacitors in the same volume and can charge and discharge much faster than batteries, making them ideal for applications requiring frequent charging, high charging speed, or sudden discharge.Nanosupercapacitors, also known as electrochemical supercapacitors or nanocapacitors, are emerging as promising energy storage devices with extremely fast charge release rates. These devices are designed to enhance power execution and high-speed capability, but they still face inherent limitations. The electrical characteristics and manufacturing processes of nanocapacitors, particularly those using metal-insulator-carbon-metal nanotube layers, are discussed. These structures exhibit high capacitance and high integration density due to their unique nanotube structure. Electron beam lithography is used to create nanoscale patterns and high aspect ratios, making these vertical nanostructures suitable for applications in dynamic random access memory (DRAM) and various nanoelectronic devices. High voltage and high energy density are achieved through multilayer nanostructure technologies, and controlled sputtering techniques can deposit ultra-smooth submicron layers of dielectric and conductive materials. This technology can lead to significant improvements in energy density. Nano supercapacitors, with their solid structure and excellent mechanical and thermal properties, are expected to revolutionize industries such as nanoelectronics. They store 100 times more charge than electrolytic capacitors in the same volume and can charge and discharge much faster than batteries, making them ideal for applications requiring frequent charging, high charging speed, or sudden discharge.