The study introduces a robust and sensitive conductive nanocomposite hydrogel with a hierarchical structural design dominated by bridge cross-linking. The hydrogel is fabricated by self-assembly-induced bridge cross-linking of MgB₂ nanosheets and polyvinyl alcohol (PVA) hydrogels. This approach combines the hierarchical lamellar microstructure with robust molecular B—O—C covalent bonds, resulting in exceptional strength and toughness. The hydrogel exhibits a response/relaxation time of 20 milliseconds and a detection lower limit of approximately 1 Pascal under external deformation, making it suitable for soft sensing applications. The hierarchical lamellar microstructure and multiple molecular bonds, including boronate-ester bonds, contribute to the hydrogel's superior mechanical properties. The hydrogel also demonstrates excellent electrical conductivity, facilitating the movement of both electrons and ions. Its noncontact speaking sensing ability and biocompatibility make it a promising material for flexible electronics, e-skins, soft robotics, and biomedical applications.The study introduces a robust and sensitive conductive nanocomposite hydrogel with a hierarchical structural design dominated by bridge cross-linking. The hydrogel is fabricated by self-assembly-induced bridge cross-linking of MgB₂ nanosheets and polyvinyl alcohol (PVA) hydrogels. This approach combines the hierarchical lamellar microstructure with robust molecular B—O—C covalent bonds, resulting in exceptional strength and toughness. The hydrogel exhibits a response/relaxation time of 20 milliseconds and a detection lower limit of approximately 1 Pascal under external deformation, making it suitable for soft sensing applications. The hierarchical lamellar microstructure and multiple molecular bonds, including boronate-ester bonds, contribute to the hydrogel's superior mechanical properties. The hydrogel also demonstrates excellent electrical conductivity, facilitating the movement of both electrons and ions. Its noncontact speaking sensing ability and biocompatibility make it a promising material for flexible electronics, e-skins, soft robotics, and biomedical applications.