A study presents a novel strategy for simultaneously enhancing the strength and electrical conductivity of bimetallic W-Cu composites through a self-assembled lamellar (SAL) architecture. The SAL architecture features alternating Cu layers and W lamellae with high-density dislocations, enabling effective stress partitioning and hetero-deformation induced strengthening. This structure also provides continuous conducting channels for electrons, reducing interface scattering and enhancing crack buffering, leading to improved plasticity. The resulting SAL W-Cu composite exhibits a yield strength nearly double that of conventional W-Cu composites, along with significantly increased electrical conductivity and large plasticity. The study demonstrates that the SAL architecture allows for the simultaneous enhancement of mechanical and electrical properties, offering a flexible design strategy for bimetallic composites. The composite was fabricated using a scalable powder metallurgy approach, involving ball milling, electroless plating, and spark plasma sintering. The SAL W-Cu composite shows excellent mechanical performance, with a compressive strength of 1300 MPa and a high electrical conductivity of 56.0% IACS. The unique SAL architecture contributes to the high strength through stress partitioning and HDI strengthening, while the crack buffering effect and continuous conducting channels enhance electrical conductivity and plasticity. The study highlights the potential of the SAL architecture for developing metallic composites with excellent integrated properties.A study presents a novel strategy for simultaneously enhancing the strength and electrical conductivity of bimetallic W-Cu composites through a self-assembled lamellar (SAL) architecture. The SAL architecture features alternating Cu layers and W lamellae with high-density dislocations, enabling effective stress partitioning and hetero-deformation induced strengthening. This structure also provides continuous conducting channels for electrons, reducing interface scattering and enhancing crack buffering, leading to improved plasticity. The resulting SAL W-Cu composite exhibits a yield strength nearly double that of conventional W-Cu composites, along with significantly increased electrical conductivity and large plasticity. The study demonstrates that the SAL architecture allows for the simultaneous enhancement of mechanical and electrical properties, offering a flexible design strategy for bimetallic composites. The composite was fabricated using a scalable powder metallurgy approach, involving ball milling, electroless plating, and spark plasma sintering. The SAL W-Cu composite shows excellent mechanical performance, with a compressive strength of 1300 MPa and a high electrical conductivity of 56.0% IACS. The unique SAL architecture contributes to the high strength through stress partitioning and HDI strengthening, while the crack buffering effect and continuous conducting channels enhance electrical conductivity and plasticity. The study highlights the potential of the SAL architecture for developing metallic composites with excellent integrated properties.