This study presents a novel approach to simultaneously enhance the strength and electrical conductivity of bimetallic materials by creating a self-assembled lamellar (SAL) architecture in a W-Cu system. The SAL architecture features alternating Cu layers and W lamellae with high-density dislocations, which enables stress partitioning in the W phase and promotes hetero-deformation-induced strengthening. The SAL architecture also provides strong crack-buffering effects and damage tolerance, while maintaining continuous conducting channels for electrons and reducing interface scattering. As a result, the SAL W-Cu composite exhibits a yield strength that is twice that of conventional composites, increased electrical conductivity, and enhanced plasticity. This study proposes a flexible strategy for designing bimetallic composites with excellent integrated properties, offering a promising solution for materials with both high strength and high conductivity.This study presents a novel approach to simultaneously enhance the strength and electrical conductivity of bimetallic materials by creating a self-assembled lamellar (SAL) architecture in a W-Cu system. The SAL architecture features alternating Cu layers and W lamellae with high-density dislocations, which enables stress partitioning in the W phase and promotes hetero-deformation-induced strengthening. The SAL architecture also provides strong crack-buffering effects and damage tolerance, while maintaining continuous conducting channels for electrons and reducing interface scattering. As a result, the SAL W-Cu composite exhibits a yield strength that is twice that of conventional composites, increased electrical conductivity, and enhanced plasticity. This study proposes a flexible strategy for designing bimetallic composites with excellent integrated properties, offering a promising solution for materials with both high strength and high conductivity.