The chapter provides an overview of sputtering, a process where atoms are removed from the surface of solids or liquids when bombarded by particles ranging from eV to MeV energies. The phenomenon, first observed over 150 years ago, has been extensively studied and is now well understood. Sputtering is used in various applications, including surface layer analysis, thin film deposition, and surface machining. The chapter discusses the different collision regimes, such as single knock-on, linear cascade, and spike, and how they affect the sputtering yield and particle distribution. It also covers the influence of target material, ion species, and bombardment conditions on sputtering yields and particle distributions. Additionally, the chapter explores the use of computer simulations to model sputtering processes and the experimental measurements that have contributed to the development of our understanding. Finally, it highlights the importance of sputtering in modern technology and physics, particularly in thin film deposition and surface analysis.The chapter provides an overview of sputtering, a process where atoms are removed from the surface of solids or liquids when bombarded by particles ranging from eV to MeV energies. The phenomenon, first observed over 150 years ago, has been extensively studied and is now well understood. Sputtering is used in various applications, including surface layer analysis, thin film deposition, and surface machining. The chapter discusses the different collision regimes, such as single knock-on, linear cascade, and spike, and how they affect the sputtering yield and particle distribution. It also covers the influence of target material, ion species, and bombardment conditions on sputtering yields and particle distributions. Additionally, the chapter explores the use of computer simulations to model sputtering processes and the experimental measurements that have contributed to the development of our understanding. Finally, it highlights the importance of sputtering in modern technology and physics, particularly in thin film deposition and surface analysis.