This study reviews recent advancements in tailoring the surface properties of polymers using non-equilibrium gaseous plasma to optimize the adhesion of various coatings. The review highlights the significant scatter in experimental results and the need for better correlation between processing parameters and adhesion. Key findings include the importance of adjusting the surface free energy or wettability of the polymer substrate and the surface tension of the deposition liquids. However, adhesion force does not always follow the evolution of surface wettability, influenced by factors such as hydrophobic recovery and the formation of interlayers rich in low molecular weight fragments. The introduction discusses the mechanisms of mechanical coupling and chemical interaction between the substrate and the coating, emphasizing the role of surface roughness and the ability of the coating to fill gaps or pores. The review covers both high-pressure and low-pressure plasmas, detailing their characteristics and the effects on polymer materials. High-pressure plasmas, such as those using helium and ammonia water, are shown to enhance wettability and adhesion through the formation of oxygen-containing functional groups. Low-pressure plasmas, which have a lower collision frequency and negligible three-body collisions, are effective in treating solid materials on an industrial scale. They enable uniform plasma distribution and higher kinetic energy of ions, leading to better surface functionalization and adhesion. The review also discusses the paradox where longer plasma treatment times do not always lead to better adhesion, due to the formation of loosely bonded molecular fragments that can be easily removed during adhesion tests. The authors recommend detailed experimental setups and plasma characterization to improve reproducibility and understanding of the plasma parameters. In conclusion, the study emphasizes the importance of balancing surface wettability and the formation of stable molecular bonds to achieve optimal adhesion.This study reviews recent advancements in tailoring the surface properties of polymers using non-equilibrium gaseous plasma to optimize the adhesion of various coatings. The review highlights the significant scatter in experimental results and the need for better correlation between processing parameters and adhesion. Key findings include the importance of adjusting the surface free energy or wettability of the polymer substrate and the surface tension of the deposition liquids. However, adhesion force does not always follow the evolution of surface wettability, influenced by factors such as hydrophobic recovery and the formation of interlayers rich in low molecular weight fragments. The introduction discusses the mechanisms of mechanical coupling and chemical interaction between the substrate and the coating, emphasizing the role of surface roughness and the ability of the coating to fill gaps or pores. The review covers both high-pressure and low-pressure plasmas, detailing their characteristics and the effects on polymer materials. High-pressure plasmas, such as those using helium and ammonia water, are shown to enhance wettability and adhesion through the formation of oxygen-containing functional groups. Low-pressure plasmas, which have a lower collision frequency and negligible three-body collisions, are effective in treating solid materials on an industrial scale. They enable uniform plasma distribution and higher kinetic energy of ions, leading to better surface functionalization and adhesion. The review also discusses the paradox where longer plasma treatment times do not always lead to better adhesion, due to the formation of loosely bonded molecular fragments that can be easily removed during adhesion tests. The authors recommend detailed experimental setups and plasma characterization to improve reproducibility and understanding of the plasma parameters. In conclusion, the study emphasizes the importance of balancing surface wettability and the formation of stable molecular bonds to achieve optimal adhesion.