This review explores the potential of two-dimensional (2D) materials in post-Moore era electronics, discussing their progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence (AI) chips, and quantum chips. It provides a comprehensive analysis of current trends and challenges in 2D material development and presents a roadmap for future advancements. The review highlights the unique properties of 2D materials, such as high carrier mobility, gate control, and quantum effects, which make them promising candidates for next-generation semiconductor devices. It also discusses the challenges in achieving circuit-level or system-level applications of 2D materials and suggests potential development pathways. The review emphasizes the importance of material synthesis, transistor engineering, dielectric engineering, contact engineering, and material integration in the development of 2D electronics. It also explores the potential of 2D materials in various applications, including AI and quantum computing, and discusses the challenges in achieving high-performance 2D devices. The review concludes that 2D materials offer significant opportunities to overcome current limitations and push the boundaries of microelectronics technology.This review explores the potential of two-dimensional (2D) materials in post-Moore era electronics, discussing their progress in digital circuits, analog circuits, heterogeneous integration, sensing circuits, artificial intelligence (AI) chips, and quantum chips. It provides a comprehensive analysis of current trends and challenges in 2D material development and presents a roadmap for future advancements. The review highlights the unique properties of 2D materials, such as high carrier mobility, gate control, and quantum effects, which make them promising candidates for next-generation semiconductor devices. It also discusses the challenges in achieving circuit-level or system-level applications of 2D materials and suggests potential development pathways. The review emphasizes the importance of material synthesis, transistor engineering, dielectric engineering, contact engineering, and material integration in the development of 2D electronics. It also explores the potential of 2D materials in various applications, including AI and quantum computing, and discusses the challenges in achieving high-performance 2D devices. The review concludes that 2D materials offer significant opportunities to overcome current limitations and push the boundaries of microelectronics technology.