This review introduces the potential of two-dimensional (2D) electronics for the post-Moore era, discussing their progress in various electronic applications such as digital and analog circuits, heterogeneous integration, sensing circuits, artificial intelligence (AI) chips, and quantum chips. It provides a comprehensive analysis of the current trends and challenges in the development of 2D materials, including material synthesis, transistor engineering, dielectric engineering, contact engineering, and material integration. The review highlights the unique properties of 2D materials, such as high carrier mobility, gate control performance, and quantum confinement effects, which make them promising candidates for advanced electronic devices. It also addresses the challenges in achieving circuit-level or system-level applications, such as material growth limitations and device performance fluctuations. The paper outlines a roadmap for the future development of 2D electronics, suggesting the most accessible and promising avenues for their realization. Key strategies for improving device performance, including novel device structures, dielectric layer integration, and contact engineering, are discussed. The review emphasizes the importance of wafer-scale material synthesis, high-quality device fabrication, and the development of cost-effective and scalable methods for 2D material integration.This review introduces the potential of two-dimensional (2D) electronics for the post-Moore era, discussing their progress in various electronic applications such as digital and analog circuits, heterogeneous integration, sensing circuits, artificial intelligence (AI) chips, and quantum chips. It provides a comprehensive analysis of the current trends and challenges in the development of 2D materials, including material synthesis, transistor engineering, dielectric engineering, contact engineering, and material integration. The review highlights the unique properties of 2D materials, such as high carrier mobility, gate control performance, and quantum confinement effects, which make them promising candidates for advanced electronic devices. It also addresses the challenges in achieving circuit-level or system-level applications, such as material growth limitations and device performance fluctuations. The paper outlines a roadmap for the future development of 2D electronics, suggesting the most accessible and promising avenues for their realization. Key strategies for improving device performance, including novel device structures, dielectric layer integration, and contact engineering, are discussed. The review emphasizes the importance of wafer-scale material synthesis, high-quality device fabrication, and the development of cost-effective and scalable methods for 2D material integration.