This book, "Thin Film Materials—Stress, Defect Formation and Surface Evolution," by L. B. Freund and S. Suresh, is a comprehensive treatise on the mechanics and behavior of thin films. It covers internal stresses, their effects on fracture, delamination, and deformation, and their significance in predicting performance and failure in engineering applications such as microelectronics, MEMS, and surface coatings. The book is structured into nine chapters, each addressing different aspects of thin film behavior, from mechanics and dislocation theory to fracture mechanics and surface evolution. The first chapter introduces the subject, discussing thin-film configurations, fabrication methods, and the relationship between microstructure and processing. It also explains the origin of stresses in thin films, including growth and induced stresses. The second chapter focuses on the relationship between film stresses and substrate curvature, deriving the Stoney formula and discussing measurement techniques. It also explores functionally graded films and large deformation effects. The third chapter addresses anisotropic and patterned films, deriving a Stoney-type formula for anisotropic films and discussing experimental methods like X-ray diffraction. The fourth chapter discusses delamination and fracture, using fracture mechanics to predict failure due to free-edge effects and analyzing various crack configurations. The fifth chapter covers film buckling, bulging, and peeling, discussing out-of-plane deflection and its consequences. Chapters 6–9 shift focus to dislocation formation, inelastic deformation, surface equilibrium, and morphology evolution. The book is a valuable reference for scientists and engineers working with thin films and related technologies. It includes example problems, case studies, and challenging exercises, making it suitable for graduate-level courses. It is recommended for university, industry, and research libraries.This book, "Thin Film Materials—Stress, Defect Formation and Surface Evolution," by L. B. Freund and S. Suresh, is a comprehensive treatise on the mechanics and behavior of thin films. It covers internal stresses, their effects on fracture, delamination, and deformation, and their significance in predicting performance and failure in engineering applications such as microelectronics, MEMS, and surface coatings. The book is structured into nine chapters, each addressing different aspects of thin film behavior, from mechanics and dislocation theory to fracture mechanics and surface evolution. The first chapter introduces the subject, discussing thin-film configurations, fabrication methods, and the relationship between microstructure and processing. It also explains the origin of stresses in thin films, including growth and induced stresses. The second chapter focuses on the relationship between film stresses and substrate curvature, deriving the Stoney formula and discussing measurement techniques. It also explores functionally graded films and large deformation effects. The third chapter addresses anisotropic and patterned films, deriving a Stoney-type formula for anisotropic films and discussing experimental methods like X-ray diffraction. The fourth chapter discusses delamination and fracture, using fracture mechanics to predict failure due to free-edge effects and analyzing various crack configurations. The fifth chapter covers film buckling, bulging, and peeling, discussing out-of-plane deflection and its consequences. Chapters 6–9 shift focus to dislocation formation, inelastic deformation, surface equilibrium, and morphology evolution. The book is a valuable reference for scientists and engineers working with thin films and related technologies. It includes example problems, case studies, and challenging exercises, making it suitable for graduate-level courses. It is recommended for university, industry, and research libraries.