Vol. 43, No. 4, April 2005 | L. B. Freund and S. Suresh
This book review discusses "Thin Film Materials—Stress, Defect Formation and Surface Evolution" by L. B. Freund and S. Suresh, published by Cambridge University Press in 2004. The book emphasizes the internal stresses and their effects on fracture, delamination, and permanent deformation of thin films, which are crucial for understanding their performance and failure. The nine chapters cover a wide range of topics, including mechanics of thin films, dislocation mechanics, and thermodynamic equilibrium and stability.
The book begins with an introduction to thin-film configurations, fabrication methods, and the relationship between microstructure and processing methods. It then delves into the effects of curvature and stresses in thin films, the principles of anisotropic elasticity, and the mechanisms of delamination and fracture. The review highlights the detailed derivations and practical examples provided, making it a valuable resource for both applied mechanicians and material scientists. The book also includes challenging problems suitable for graduate-level courses, making it a comprehensive reference for researchers and engineers working in the field of thin films.This book review discusses "Thin Film Materials—Stress, Defect Formation and Surface Evolution" by L. B. Freund and S. Suresh, published by Cambridge University Press in 2004. The book emphasizes the internal stresses and their effects on fracture, delamination, and permanent deformation of thin films, which are crucial for understanding their performance and failure. The nine chapters cover a wide range of topics, including mechanics of thin films, dislocation mechanics, and thermodynamic equilibrium and stability.
The book begins with an introduction to thin-film configurations, fabrication methods, and the relationship between microstructure and processing methods. It then delves into the effects of curvature and stresses in thin films, the principles of anisotropic elasticity, and the mechanisms of delamination and fracture. The review highlights the detailed derivations and practical examples provided, making it a valuable resource for both applied mechanicians and material scientists. The book also includes challenging problems suitable for graduate-level courses, making it a comprehensive reference for researchers and engineers working in the field of thin films.