Van der Waals (vdW) integration offers a bond-free method for integrating diverse materials without strict lattice matching or processing compatibility, enabling flexible integration beyond two-dimensional materials. Traditional integration methods like epitaxial growth or physical vapor deposition (PVD) rely on strong chemical bonds and are limited by lattice matching and processing conditions, often leading to interface disorder and defects. In contrast, vdW integration uses weak intermolecular forces to assemble pre-fabricated building blocks, allowing the integration of materials with different lattice structures and processing conditions. This approach enables the creation of artificial heterostructures and superlattices with clean, sharp interfaces, offering new opportunities for fundamental studies and device applications. vdW integration has been successfully applied to create 2D/2D heterostructures with high carrier mobility and unique electronic properties. It has also been extended to integrate 0D, 1D, and 3D materials, enabling the development of novel devices such as photodiodes, transistors, and optoelectronic components. The integration of 2D materials with 3D materials, such as MoS₂ with Ge, has enabled the creation of high-performance devices with tunable Schottky barriers and efficient electron tunneling. Additionally, vdW integration has been used to create flexible and stretchable devices, where the sliding interface allows for strain release and maintains clean interfaces. The plug-and-probe approach allows for the rapid integration of multiple functional components without additional lithography, enabling the investigation of intrinsic material properties. This method is particularly useful for delicate materials that degrade quickly under conventional fabrication processes. Furthermore, vdW integration offers a scalable and cost-effective approach for system-level integration, enabling the assembly of complex devices with reduced process cost and device footprint. Despite its potential, challenges remain in achieving high-yield, scalable vdW integration of heterostructure device arrays. These include issues such as alignment resolution, interface uniformity, and stability of weakly bonded interfaces. Addressing these challenges requires interdisciplinary efforts in chemistry, materials science, and engineering to develop advanced fabrication techniques and automated stamping machines. The future of vdW integration lies in its ability to bridge the gap between academic research and industrial applications, enabling the development of next-generation electronic and optoelectronic devices.Van der Waals (vdW) integration offers a bond-free method for integrating diverse materials without strict lattice matching or processing compatibility, enabling flexible integration beyond two-dimensional materials. Traditional integration methods like epitaxial growth or physical vapor deposition (PVD) rely on strong chemical bonds and are limited by lattice matching and processing conditions, often leading to interface disorder and defects. In contrast, vdW integration uses weak intermolecular forces to assemble pre-fabricated building blocks, allowing the integration of materials with different lattice structures and processing conditions. This approach enables the creation of artificial heterostructures and superlattices with clean, sharp interfaces, offering new opportunities for fundamental studies and device applications. vdW integration has been successfully applied to create 2D/2D heterostructures with high carrier mobility and unique electronic properties. It has also been extended to integrate 0D, 1D, and 3D materials, enabling the development of novel devices such as photodiodes, transistors, and optoelectronic components. The integration of 2D materials with 3D materials, such as MoS₂ with Ge, has enabled the creation of high-performance devices with tunable Schottky barriers and efficient electron tunneling. Additionally, vdW integration has been used to create flexible and stretchable devices, where the sliding interface allows for strain release and maintains clean interfaces. The plug-and-probe approach allows for the rapid integration of multiple functional components without additional lithography, enabling the investigation of intrinsic material properties. This method is particularly useful for delicate materials that degrade quickly under conventional fabrication processes. Furthermore, vdW integration offers a scalable and cost-effective approach for system-level integration, enabling the assembly of complex devices with reduced process cost and device footprint. Despite its potential, challenges remain in achieving high-yield, scalable vdW integration of heterostructure device arrays. These include issues such as alignment resolution, interface uniformity, and stability of weakly bonded interfaces. Addressing these challenges requires interdisciplinary efforts in chemistry, materials science, and engineering to develop advanced fabrication techniques and automated stamping machines. The future of vdW integration lies in its ability to bridge the gap between academic research and industrial applications, enabling the development of next-generation electronic and optoelectronic devices.